We all know that electronic chips are the core of electronic products and all control and computation are concentrated in the chip, so why do we need smaller things? sand and dust test chamber is used for the dustproof test. In general, the chip is in the product shell and is rarely affected by sand and dust, but some exceptions are not excluded, such as the ingress of sand and dust caused by the damage of the shell, will affect the normal operation of the electronic chip . Also, like the main computer case, the shell has cooling holes, so every time we open the shell, we will find that the motherboard is full of dust, which will also affect the normal operation.
So through the dust test box, you can simulate different sand and dust intrusion scenes, through the electronic chipsand dust test box
The dust tightness test of electronic chips mainly studies the impact of sand and dust particles of different particle sizes on electronic chips. The purpose of the test is to test the protection of the electronic product's case against the internal chips and other components, and to understand the impact of dust ingress on the chip and whether there will be a short circuit and fire. The dust test chamber is used to create environments with different temperatures and humidity, and different concentrations of dust are used to test electronic chips.
Dust with the size of conventional dust particles is generally used as a test source when performing dust tightness tests on electronic chips
. The dust-proof level required for electronic chips is generally IP5 orIP6, which is designed to completely prevent the entry of dust, or the dust will not affect the normal operation of chip components after entry. In general, the dustproof test of electronic chips is carried out with the highest protection level of IP6, because excessive accumulation of sand and dust will cause damage to electronic chips, so complete dust removal is the best protection method.
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