So the sand and dust test chamber can simulate various sand and dust intrusion scenarios, and through the sand and dust test of electronic chips, it is possible to find the design protection defects of electronic chips very well.
The dust tightness test of electronic chips mainly studies the impact of sand and dust particles of different particle sizes on electronic chips. The purpose of the test is to test the protection of the electronic product's case against the internal chips and other components, and to understand the impact of dust ingress on the chip and whether there will be a short circuit and fire. The dust test chamber is used to create environments with different temperatures and humidity, and different concentrations of dust are used to test electronic chips.
Dust with the size of conventional dust particles is generally used as a test source when conducting dust-dicintegrity testing on electronic chips. The dust-proof level required for electronic chips is generally IP5 or IP6, which is designed to completely prevent the ingress of dust, or the dust will not affect the normal operation of chip components after entry. In general, the dustproof test of electronic chips is carried out with the highest protection level of IP6, because excessive accumulation of sand and dust will cause damage to electronic chips, so complete dust removal is the best protection method.