High and low temperature, humidity and heat environment test chamber for chips

Chip high and low temperature humidity and heat test chamber: Suitable for high and low temperature reliability testing of industrial products. It is able to simulate the atmospheric environment by cyclically testing various performance indicators of components and materials of related products such as electronic and electric vehicles, aerospace, ship weapons, colleges and universities and scientific research units under high temperature and low temperature (alternately). become changeand temperature fluctuations. The material is transported in a comprehensive high and low temperature environment, and the adaptability test is carried out during use. Used in product design, identification and inspection of improvements, and other links.

Meet the experimental conditions:

GB/T11158-2008 High Temperature Test Chamber Technical Conditions;

GB/T10589-2008 Low Temperature Test Chamber Technical Conditions;

GB/T10592-2008 High and Low Temperature Test Chamber Technical Conditions;

GB /T10586-2006 Humidity and Heat Test Chamber Technical Article File;

GB/T2423.1- 2008 Test A: Low temperature test method;

GB/T2423.2-2008 Test B: High Temperature Test Method; .

GB/T2423.3-2006 Humidity and Heat Test Chamber Test Method;

GB/ T2423.4-2008 Moist Heat Alternating Test Method;

GB/T2423.22-2002 change temperature test method;

GB/T 2423.22 -2012 Test Method Test N: Temperature Change

GJB150.3-2009 high temperature experiment

GJB150.4-2009 low temperature test

IEC60068-2-1: 2007 low-temperature chamber test method; IEC68-2-1 Test A: cold;

IEC60068-2-2: 2007 high temperature chamber test method; IEC68-2-2 Test B: dry heat;

GJB150.3 High temperature test; GJB150.4 Low temperature test; GJB150.9 Damp heat test;

High and low temperature, humidity and heat environment test box Technical parameters:

model

LQ-GD-80 series

LQ-GD-100 series

LQ-GD-200 Series

LQ-GD-500series

LQ-GD-800 series

LQ-GD -1000 Series

 

Operation function

Constant temperature operation, program temperature operation

Program memory

Memory capacity

120 groups, 1200 segments

Cooling method

Mechanicalhe single-stage compressor refrigeration/mechanical

Binary cascade compressor refrigeration (air-cooled condenser)

Fridge

French Taikang hermetic compressor unit or German Copeland semi-hermetic compressor unit< /p>

Refrigerant

Environmentally friendly refrigerant R404A+R23

Condenser

Finned heat exchanger