Accessories PID temperature control Test chamber with rapid temperature change

PID temperature control with rapid temperature change test chamberSuitable for electronics, electrical appliances, mobile phones, communications, instruments, vehicles, plastic products, metals, food, chemicals, building materials, Medical, aerospace and other product quality inspection purposes.

PID temperature control rapid temperature change test chamber: the product you use below the limit of structural strength, the temperature acceleration technique (when cycling in the upper and lower limit temperature, the product will alternately expand and contract) to change the external environmental stress, so thermal stress and strain will be generated The defects hidden in the product appear [ potential part material defects, process defects, process defects] to avoid failure of the product if during useending is tested by environmental pollution

Causes unnecessary loss, which greatly affects the improvement of product delivery yield and the reduction of number of repairs. In addition, the stress screening itself is a process in the process phase, rather than a reliability test, therefore the stress screening is a procedure performed on 100 pairs of products.

Meet test method:

GB/T 2423.1-2008 Test A: Low temperature test method

GB/T 2423.2-2008 Test B: high temperature test method

GJB 150.3A – 2009 High Temperature Test

GJB 150.4A—2009 Low Temperature Test

GB/T2423.22 – 2008 Test Nb Temperature Change Test

Product manufacturing standard: GB/T10589-2008 Low Temperature Test Chamber Technical ConditionsGB/T11158-2008 High Temperature Test Chamber Technical ConditionsGB T5170.1- 2008 General rules for testing methods of environmental testing equipment for the electrical and electronics industryGB/T5170.2 Basic parameter verification method